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翻訳と辞書　辞書検索 [ 開発暫定版 ] スポンサード リンク Tape-automated bonding ： ウィキペディア英語版 Tape-automated bonding Tape-automated bonding (TAB) is a process that places bare integrated circuits onto a printed circuit board (PCB) by attaching them to fine conductors in a polyamide or polyimide film, thus providing a means to directly connect to external circuits. ==Process== The tape-automated bonding process places bare integrated circuits onto a printed circuit board. The mounting is done such that the bonding sites of the die, usually in the form of bumps or balls made of gold or solder, are connected to fine conductors on the tape, which provide the means of connecting the die to the package or directly to external circuits. Sometimes the tape on which the die is bonded already contains the actual application circuit of the die.〔(TAB ) at Silicon Far East on-line.〕 The film is moved to the target location, and the leads are cut and soldered as necessary. The bare chip may then be encapsulated ("glob topped") with epoxy or plastic.〔(【引用サイトリンク】publisher=Centre for High Performance Integrated Technologies and Systems (CHIPTEC) )〕 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Tape-automated bonding」の詳細全文を読む スポンサード リンク 翻訳と辞書 : 翻訳のためのインターネットリソース Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.